INDIUM Indium Corporation Halogen-Free Solder Flux WS-446HF for Bumping and Flip Chip Applications

INDIUM WS-446HF Halogen-Free Flux for BGA Solder Ball Placement and Flip Chip

Indium Corporation has expanded its flux product line with the introduction of a robust new flux, WS-446HF, designed to provide simple solutions for complex applications, particularly for single-clean-step processes in BGA solder ball placement and flip chip assembly.

WS-446HF is a water-soluble, halogen-free flip chip dipping flux with a powerful activator system that promotes excellent wetting on the most challenging soldering surfaces—including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip chip applications on lead frames. WS-446HF helps improve yield by minimizing non-wetting open defects, missing balls, and eliminating electrochemical migration (ECM).

WS-446HF offers the following features:

- Contains a chemical agent that eliminates dendrite issues, particularly critical for fine-pitch flip chip applications 

- Provides tackiness suitable for holding solder balls and dies in place during assembly, eliminating missing balls, and reducing die tilt and non-wetting opens caused by warpage  

- Delivers consistent pin release, printing, and dipping performance, ensuring uniform soldering quality and improving production yield 

- Enables a single-step ball placement process without multiple flux steps and eliminates warpage effects caused by pre-coated flux  

- Offers excellent room-temperature deionized water cleaning performance, preventing the formation of white residues

INDIUM WS-446HF Halogen-Free Flux for BGA Solder Ball Placement and Flip Chip